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The basic test method is performed by adhering tape of known properties onto the plating, rapidly removing the tape, then FIGURE 517 Minimum external annular ring (includes plating) (Courtesy of IPC) inspecting the tape for removed plating on the tape adhesive 5111135 Peel Strength Peel strength is the force per unit width required to peel the conductor or foil from the base material It is usually associated with the acceptance testing of copper-clad base material upon receipt, but it is sometimes used to test the adhesion of the conductors to the finished PCB Peel strength tests of conductors are usually performed after the specimens have been dip or reflow soldered Peel strength tests of conductors are a good method of ensuring that the conductor-to-base material adhesion is sufficient to withstand assembly and rework operations 511114 Hole Characteristics.

PTHs provide circuit interconnection from the surface of the PCB to internal layers and to circuitry on the opposite side For this reason, much attention is correctly focused on the acceptability and quality of these holes Nonconformance in the PTHs is a serious concern 5111141 Roughness and Nodulation Roughness is an irregularity in the side wall of a hole; nodulation is a small knot or an irregular lump found in or on the plating Although roughness and nodulation are not desirable, they are allowable in small amounts Roughness and nodulation create one or more of the following nonconforming conditions:.

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Reduced hole diameter Impaired lead insertion Impaired solder flow through the hole Voids in solder fillet 51.11.1.4.2 Voids in the Plating and Finished Coating. A void is the absence of material where it is intended to be. Copper-plating voids are evaluated again during microsectional analysis, but this sampling is very small and this attribute should be thoroughly evaluated during visual inspection of the PCB. When visually evaluating voids in the PTH copper, no more than 5 percent of the holes on the PCB should exhibit evidence of voids. In holes that have voids (see Fig. 51.8), there should be no more than one void that is less than 5 percent of the hole length. Voids in the finish coating of the PCB (see Fig. 51.9) that do not extend to the copper plating are allowed in larger quantities than voids in the copper plating. There should again be surface finish voids in no more than 5 percent of the PCB holes, and these holes should have no more than three voids that are each less than 5 percent of the hole length.

Plating void. (Courtesy of IPC.)

297 Logic analyzer trace of the data transmitted by the frequency counter to the PC and the input frequency to the frequency counter 297 Logic analyzer trace of the data transmitted by the PC RS-232 port on the TxD pin and rectified and clamped to convert to unipolar, TTL-level signal on the PB1 pin of the frequency counter 298 User interface for the frequency counter 299 Plot of the input frequency and the measured frequency of the frequency counter 300.

Fig 842: Die level packaging of an accelerometer [6]

FIGURE 51.9 Voids in finished coating. (Courtesy of IPC.)

5111143 Hole Diameter Hole size is the inner clearance diameter of the finished plated-through or unplated hole A PTH is a hole in which electrical connection is made between internal or external conductive patterns, or both, by the deposition of metal on the wall of the hole An unplated hole, termed an unsupported hole, is a hole containing no conductive material Hole size measurement is performed to verify that the hole meets the intended design requirements This size requirement is usually associated with the fit of component leads, mounting hardware, etc, plus adequate clearance for attachment metal PTHs providing layer-to-layer interconnections, where no components are soldered into the hole, are called via holesVia holes do not have a fit requirement, so only the plating integrity is critical Drill blank plugs and optical magnifiers are used to verify hole diameter.

The latter method is utilized when soft coatings over the copper are usedThe optical method prevents deformation or removal of the soft coatings within the hole When drill blank plug gauges are used, the inspector should use a soft touch to prevent damage to the hole The drill blank gauges should be cleaned prior to use to prevent solderability degradation Plating nodules are sometimes present in the hole and restrict the penetration of the gauges Forcing the gauges into the holes causes the nodules to be dislodged, resulting in voids in the PTH side wall 5111144 Lifted Lands During visual examination there should be no evidence of the lifting of lands from the base material surface Lifted lands can trap contaminates during the assembly process and are considered undesirable for assembly 511115 Marking (Legend/Silkscreen) Imperfections.

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